Title: Heat resistant sustainable adhesives based on soy
Author: O'Dell, Jane L.; Hunt, Christopher G.; Frihart, Charles
Source: Proceedings, 33rd Annual Meeting of the Adhesion Society, Inc., February 21-24, 2010, Daytona Beach, FL. [Blacksburg, Va.] : Adhesion Society, 2010: p. 229-231.
Description: Some biobased polymers have limited softening and depolymerization at elevated temperatures, which should make them perform well for structural wood composites under fire conditions. Our goals in this study were to develop tests for understanding material properties of biobased adhesives and to apply these tests to help understand failure of bonded materials. We characterized thermal performance of soy protein isolate alone and combined with several common denaturants using dynamic mechanical analysis (DMA).
Keywords: Soy flour, adhesives, testing, soybean glue, glue, adhesion, thermal analysis, elasticity, modulus of elasticity, fire testing, glass fibers, thermal fatigue, composite materials, thermal properties, proteins, phenols, formaldehyde, bonding, bond strength, failure, thermal degradation, dynamic mechanical analysis, polymers, polymerization, stiffness, fire hazard, fire resistance, gluing
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O'Dell, Jane L.; Hunt, Christopher G.; Frihart, Charles. 2010. Heat resistant sustainable adhesives based on soy. In: Anderson, Gregory, ed. Proceedings 33rd annual Mmeting of the Adhesion Society, Inc. 2010 February 21-24. Daytona Beach, FL. Blacksburg, VA: Adhesion Society, Inc.: 229-231.
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