Title: Wood-adhesive bonding failure : modeling and simulation
Author: Cai, Zhiyong
Source: Wood Adhesives 2009 [electronic resource]. FPS proceedings no. 7216-09. Madison, WI : Forest Products Society, c2010 [1 CD-ROM]: p. 235-239: ISBN: 9781892529572: 1892529572.
Description: The mechanism of wood bonding failure when exposed to wet conditions or wet/dry cycles is not fully understood and the role of the resulting internal stresses exerted upon the wood-adhesive bondline has yet to be quantitatively determined. Unlike previous modeling this study has developed a new two-dimensional internal-stress model on the basis of the mechanics of layered composites. Plywood panel is regarded as a multi-layered composite material where each layer (including bonding line) has different properties. When the plywood panel experiences moisture changes through its thickness, internal stresses and their corresponding strains develop among its layers. The model can be used to quantitatively simulate the relationship between the internal stresses and the panel parameters which include layer thickness, modulus of elasticity, linear expansion coefficient, Poisson’s ratio, shear modulus, density, and orientation of layers. The results may provide a better understanding of bonding failure during the water-exposure test. This paper describes the model development.
Keywords: Plywood, moisture, adhesives, adhesion, glue, mechanical properties, gluing, strains, stresses, models, elasticity, engineering models, wood deterioration, deterioration, composite materials, modulus of elasticity, orientation, density, wood bonding, moisture content, flexibility, failure, bonding, durability, bond strength, failures in wood, bondline, Poisson's ratio, linear expansion coefficient
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Cai, Zhiyong 2010. Wood-adhesive bonding failure : modeling and simulation. Wood Adhesives 2009 [electronic resource]. FPS proceedings no. 7216-09. Madison, WI : Forest Products Society, c2010 [1 CD-ROM]: p. 235-239: ISBN: 9781892529572: 1892529572.
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