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Publication Information

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Title: Investigation of “benign” ionic content in epoxy that induces microelectronic device failure

Author: Schueneman, Gregory T.; Kingsbury, Jeffery; Klinkerch, Edmund;

Date: 2011

Source: Proceedings of the 34th annual meeting of the Adhesion Society, 2011 February 13-16, Savannah, GA. Blacksburg, VA : The Adhesion Society, 2011: 3 p.

Publication Series: Paper (invited, offered, keynote)

Description: Microelectronics and the devices dependent upon them have the extremely challenging requirements of becoming more capable and less expensive every year. This drives the industry to pack more functions into an ever smaller footprint until the next technological revolution. Adding to this situation is the removal of lead from the bill of materials followed closely by efforts to remove halogens. One result of this cycle and materials changes is new modes of device failure that lead root cause investigations back to the basics of chip fabrication (fab) and packaging processes and materials. Herein is presented the root cause analysis of a current leakage failure where ionic content in a non-halogen containing epoxy molding compound is shown to be the cause.

Keywords: Glues, adhesion, adhesives, epoxy resins, epoxy compounds, microelectronics, molding materials, ions, semiconductors, metal oxide semiconductors, transistors, gluing, durability, failure, bond strength, bonding, strength, leakage

Publication Notes:

  • We recommend that you also print this page and attach it to the printout of the article, to retain the full citation information.
  • This article was written and prepared by U.S. Government employees on official time, and is therefore in the public domain.

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Schueneman, Gregory T.; Kingsbury, Jeffery; Klinkerch, Edmund; 2011. Investigation of “benign” ionic content in epoxy that induces microelectronic device failure. In: Proceedings of the 34th annual meeting of the Adhesion Society, 2011 February 13-16, Savannah, GA. Blacksburg, VA : The Adhesion Society, 2011: 3 p.

 


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