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Title: Adhesive in the buckling failure of corrugated fiberboard : a finite element investigation

Author: Rahman, Adeeb A.; Abubakr, Said M.;

Date: 1998

Source: [Proceedings of the 1998 ANSYS conference : simulating real life : software with no boundaries : 1998 August 17-19, Pittsburgh. Canonsburg, PA : ANSYS, Inc., 1998?].:p. 533-539 : ill.

Publication Series: Miscellaneous Publication

Description: This research study proposed to include the glue material in a finite element model that represents the actual geometry and material properties of a corrugated fiberboard. The model is a detailed representation of the different components of the structure (adhesive, linerboard, medium) to perform buckling analysis of corrugated structures under compressive loads. The objective of this analysis was to quantify the influence of the adhesive on the structural performance of corrugated fiberboard. Adhesive parameters are identified in terms of adhesive stiffness and material properties. The modulus of elasticity of the adhesive is taken relative to the modulus of a linerboard material. Three adhesive strength properties representing minimum, medium, and maximum moduli values are considered. The analysis also addresses the buckling failure of fiberboard when adhesion is ineffective along a glue line. Results show that increasing the adhesive modulus (20 times that of linerboard) tends to strengthen the fiberboard buckling carrying capacity up to 50%. Loss of adhesive along a fiberboard glue line substantially decreases the buckling strength of the structure.

Keywords: Adhesives, Fiberboards, Corrugations, Failure, Models, Boxes, Strength, Finite element analysis

Publication Notes:

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  • This article was written and prepared by U.S. Government employees on official time, and is therefore in the public domain.

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Rahman, Adeeb A.; Abubakr, Said M. 1998. Adhesive in the buckling failure of corrugated fiberboard : a finite element investigation. [Proceedings of the 1998 ANSYS conference : simulating real life : software with no boundaries : 1998 August 17-19, Pittsburgh. Canonsburg, PA : ANSYS, Inc., 1998?].:p. 533-539 : ill.

 


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