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Title: How overdrying wood reduces its bonding to phenol-formaldehyde adhesives : a critical review of the literature. Part I, Physical responses
Author: Christiansen, Alfred W.;
Source: Wood and fiber science. Vol. 22, no. 4 (1990): Pages 441-459
Publication Series: Miscellaneous Publication
Description: This review critically evaluates literature on the ways in which excessive drying (overdrying) inactivates wood surfaces to bonding, primarily for phenolic adhesives. In Part I of a two-part review, three inactivation mechanisms involving physical responses to overdrying are considered: (1) exudation of extractives to the surface, which lowers the wettability or hides the surface; (2) reorientation of wood surface molecules, which reduces wettability or places for bonding; and (3) irreversible closure of large micropores in cell walls. I believe that extensive evidence from wood bonding and paper sizing research supports the mechanism of extractives-induced low wettability as the cause for inactivation of Douglas-fir and southern pines. Molecular reonentation and irreversible micropore closure are proposed wood inactivation mechanisms that involve loss of wettability and bonding sites.
Keywords: Drying, inactivation, adhesive, bonding, review, extractives, mechanism, wettability
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Christiansen, Alfred W. 1990. How overdrying wood reduces its bonding to phenol-formaldehyde adhesives : a critical review of the literature. Part I, Physical responses. Wood and fiber science. Vol. 22, no. 4 (1990): Pages 441-459
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